Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11508614 | Method of forming semiconductor device having capped air gaps between buried bit lines and buried gate | Li-Wei Feng, Ying-Chiao Wang, Tzu-Tsen Liu, Tsung-Ying Tsai | 2022-11-22 |