Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11508614 | Method of forming semiconductor device having capped air gaps between buried bit lines and buried gate | Li-Wei Feng, Ying-Chiao Wang, Tzu-Tsen Liu, Chien-Ting Ho | 2022-11-22 |
| 11256139 | Support pin having brightness enhancement structures and backlight module with the same | — | 2022-02-22 |