Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11488900 | Wiring board with interposer substrate surrounded by underfill and embedded in main substrate and method of fabricating the same | Yan-Jia Peng, Pu-Ju Lin | 2022-11-01 |
| 11483925 | Circuit board and manufacture method of the circuit board | Chun-Hung Kuo | 2022-10-25 |