Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11488900 | Wiring board with interposer substrate surrounded by underfill and embedded in main substrate and method of fabricating the same | Kuo-Ching Chen, Pu-Ju Lin | 2022-11-01 |
| 11234324 | Circuit board structure and manufacturing method thereof | Ping-Che YANG, Tsun-Sheng Chou | 2022-01-25 |