Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11520429 | Three-dimensional sensing module and method of manufacturing the same and electronic apparatus | Lien-Hsin Lee, Ren Hung Wang, Cai Jin Ye, Wei-Yi Lin, Tai-Shih Cheng +2 more | 2022-12-06 |