Issued Patents 2022
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11520429 | Three-dimensional sensing module and method of manufacturing the same and electronic apparatus | Lien-Hsin Lee, Cai Jin Ye, Wei-Yi Lin, Tai-Shih Cheng, Tsai-Kuei Wei +2 more | 2022-12-06 |
| 11520448 | Three-dimensional sensing device and method of manufacturing the same | Feng-Ming Lin, Yu-Ting Chan, Lien-Hsin Lee, Tai-Shih Cheng | 2022-12-06 |
| 11269435 | Three-dimensional sensing panel and method of manufacturing the same and electronic apparatus | Lien-Hsin Lee, Yan Zhao, Jenchang Liu, Tai-Shih Cheng, Jun Zhong +2 more | 2022-03-08 |
| 11216143 | Force sensing module and method of manufacturing the same and electronic device | Lien-Hsin Lee, Wei-Yi Lin, Fengming Lin, Wen Shan Cheng, Ming-Hsien Ko +2 more | 2022-01-04 |