Issued Patents 2022
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11490528 | Method for manufacturing wiring board, and wiring board | Kazuaki Okamoto, Rentaro Mori | 2022-11-01 |
| 11425823 | Method for producing wiring substrate | Haruki KONDOH, Rentaro Mori, Keiji Kuroda, Kazuaki Okamoto | 2022-08-23 |
| 11425824 | Method for producing wiring substrate | Keiji Kuroda, Haruki KONDOH, Kazuaki Okamoto, Rentaro Mori | 2022-08-23 |