Issued Patents 2022
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11490528 | Method for manufacturing wiring board, and wiring board | Hiroshi Yanagimoto, Rentaro Mori | 2022-11-01 |
| 11425823 | Method for producing wiring substrate | Haruki KONDOH, Rentaro Mori, Hiroshi Yanagimoto, Keiji Kuroda | 2022-08-23 |
| 11425824 | Method for producing wiring substrate | Keiji Kuroda, Haruki KONDOH, Rentaro Mori, Hiroshi Yanagimoto | 2022-08-23 |
| 11225728 | Film forming device and method for forming metal film using the same | Yuuki Satou | 2022-01-18 |