RM

Ryuma Mizusawa

TC Tokyo Ohka Kogyo Co.: 1 patents #31 of 107Top 30%
Overall (2022): #276,922 of 548,613Top 55%
1
Patents 2022

Issued Patents 2022

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
11491772 Substrate bonding method and laminated body production method Tomoyuki Ando 2022-11-08