Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11491772 | Substrate bonding method and laminated body production method | Ryuma Mizusawa | 2022-11-08 |
| 11415888 | Negative type photosensitive resin composition, photosensitive resist film, pattern forming method, cured film, and method of producing cured film | Ryosuke Nakamura, Tokunori YAMADAYA | 2022-08-16 |