Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11488929 | Bonding apparatus, bonding system, bonding method, and recording medium | Takashi Nakamitsu, Shuhei Matsumoto | 2022-11-01 |
| 11482431 | Substrate processing apparatus and substrate processing method | Kimio Motoda, Norifumi Kohama, Norio Wada, Kenji Sugakawa | 2022-10-25 |