Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11315789 | Method and structure for low density silicon oxide for fusion bonding and debonding | Kiyotaka Imai, Hirokazu Aizawa, Hiroshi Maeda, Kaoru Maekawa, Yuji Mimura | 2022-04-26 |