Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11519881 | Method for the evaluation of adhesive bond strength via swept-frequency ultrasonic phase measurements | Harold A. Haldren, Daniel F. Perey, K. Elliott Cramer, Mool C. Gupta | 2022-12-06 |