Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11519881 | Method for the evaluation of adhesive bond strength via swept-frequency ultrasonic phase measurements | Harold A. Haldren, Daniel F. Perey, William T. Yost, Mool C. Gupta | 2022-12-06 |
| 11373264 | Method and means to analyze thermographic data acquired during automated fiber placement | Peter D. Juarez, Elizabeth D. Gregory | 2022-06-28 |