Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11355413 | Adhesive film, semiconductor apparatus using the same, and semiconductor package including the same | Joungphil Lee, Myung-Sung Kang, Yeongseok Kim, Gwangsun Seo, Hyein Yoo | 2022-06-07 |
| 11342310 | Semiconductor chip, semiconductor device, and semiconductor package including the semiconductor chip | Wonkeun Kim, Inyoung Lee | 2022-05-24 |