Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11355413 | Adhesive film, semiconductor apparatus using the same, and semiconductor package including the same | Joungphil Lee, Myung-Sung Kang, Yeongseok Kim, Hyein Yoo, Yongwon Choi | 2022-06-07 |