RW

Rongfu Wen

UC University of Colorado, A Body Corporate: 1 patents #17 of 196Top 9%
Overall (2022): #279,685 of 548,613Top 55%
1
Patents 2022

Issued Patents 2022

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
11306983 Single and multi-layer mesh structures for enhanced thermal transport Ronggui Yang, Shanshan Xu, Yung-Cheng Lee 2022-04-19