Issued Patents 2022
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11511377 | Conformal thermal ground planes | Michael Hulse, William Francis | 2022-11-29 |
| 11353269 | Thermal ground plane | Ronggui Yang, Victor M. Bright, Chen Li, Christopher Oshman, Bo Shi +2 more | 2022-06-07 |
| 11306983 | Single and multi-layer mesh structures for enhanced thermal transport | Ronggui Yang, Rongfu Wen, Shanshan Xu | 2022-04-19 |