Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11515275 | Copper wire bond on gold bump on semiconductor die bond pad | Lin Zhang, Huo Yun Duan, Xi Li, Chen Xiong | 2022-11-29 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11515275 | Copper wire bond on gold bump on semiconductor die bond pad | Lin Zhang, Huo Yun Duan, Xi Li, Chen Xiong | 2022-11-29 |