Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11515275 | Copper wire bond on gold bump on semiconductor die bond pad | Lin Zhang, Huo Yun Duan, Chen Xiong, Xiao Lin Kang | 2022-11-29 |
| 11394172 | Laser driver with high-speed and high-current and integrated circuit thereof | Fujiang Lin, Ahmed Wahba Abdalla Elsayed | 2022-07-19 |