Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11404309 | Vias for cobalt-based interconnects and methods of fabrication thereof | Min-Yann Hsieh, Hua Feng Chen, Kuo-Hua Pan | 2022-08-02 |
YC
Yu-Jen Chang
Overall (2022): #194,940 of 548,613Top 40%
1
Patents 2022