Issued Patents 2022
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11404309 | Vias for cobalt-based interconnects and methods of fabrication thereof | Yu-Jen Chang, Hua Feng Chen, Kuo-Hua Pan | 2022-08-02 |
| 11282751 | Dielectric fins with different dielectric constants and sizes in different regions of a semiconductor device | Hua Feng Chen, Jhon Jhy Liaw | 2022-03-22 |
| 11251181 | FinFET isolation structure and method for fabricating the same | Wen-Che Tsai, Hua Feng Chen, Kuo-Hua Pan | 2022-02-15 |