Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11462447 | Sensor package substrate, sensor module including the same, and electronic component embedded substrate | Yoshihiro Suzuki, Akira MOTOHASHI | 2022-10-04 |
| 11393761 | Circuit board and its manufacturing method | Yoshihiro Suzuki | 2022-07-19 |