Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11492696 | Manufacturing method for semiconductor laminated film, and semiconductor laminated film | Yoshiyuki Suda, Takahiro Tsukamoto, Kyohei Degura, Katsumi Okubo, Takuma YAGI +3 more | 2022-11-08 |
| 11462447 | Sensor package substrate, sensor module including the same, and electronic component embedded substrate | Kazutoshi TSUYUTANI, Yoshihiro Suzuki | 2022-10-04 |