Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11414532 | Resin composition, and prepreg, metal-clad laminate, and printed circuit board using the same | Chih-Wei Liao, Tsung-Hsien Lin, Ju-Ming Huang | 2022-08-16 |
| 11339258 | Resin composition, and pre-preg, metal-clad laminate and printed circuit board prepared using the same | Chih-Wei Liao, Tsung-Hsien Lin, Ju-Ming Huang, Chen-Hua Yu | 2022-05-24 |