Issued Patents 2022
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11414532 | Resin composition, and prepreg, metal-clad laminate, and printed circuit board using the same | Guan-Syun Tseng, Tsung-Hsien Lin, Ju-Ming Huang | 2022-08-16 |
| 11404770 | Antenna structure and wireless communication device | Jia Xie, Jia-Hung Hsiao | 2022-08-02 |
| 11339258 | Resin composition, and pre-preg, metal-clad laminate and printed circuit board prepared using the same | Guan-Syun Tseng, Tsung-Hsien Lin, Ju-Ming Huang, Chen-Hua Yu | 2022-05-24 |
| 11334115 | Electronic device assembly | Yu-Shih Wang, Yi-Ta Huang, Chih-Chun Liu, Cheng-Nan Ling, Wen-Chieh Tai +5 more | 2022-05-17 |
| 11306239 | High thermal conductivity prepreg and uses of the same | Chen-Hua Yu | 2022-04-19 |