Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11328982 | Air gap seal for interconnect air gap and method of fabricating thereof | Xusheng Wu | 2022-05-10 |
| 11302784 | Semiconductor device having contact feature and method of fabricating the same | Xusheng Wu, Chang-Miao Liu, Ying-Keung Leung, Huiling Shang | 2022-04-12 |