Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11430733 | Method of testing wafer | Chia-Yi Tseng, Chih-Hsun Lin, Kun-Tsang Chuang, Yung-Lung Hsu | 2022-08-30 |
YH
Yen-Hsung Ho
Overall (2022): #202,103 of 548,613Top 40%
1
Patents 2022