Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11430733 | Method of testing wafer | Yen-Hsung Ho, Chia-Yi Tseng, Kun-Tsang Chuang, Yung-Lung Hsu | 2022-08-30 |
| 11257719 | Methods for improving interlayer dielectric layer topography | Kuan-Wei Su, Chun-Yu Huang, Ping-Pang Hsieh | 2022-02-22 |