Issued Patents 2022
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11508766 | Molded image sensor chip scale packages and related methods | — | 2022-11-22 |
| 11508776 | Image sensor semiconductor packages and related methods | Larry D. Kinsman, Yusheng LIN, Yu-Te HSIEH, Oswald Skeete, Chi-Yao Kuo | 2022-11-22 |
| 11289522 | Controllable gap height for an image sensor package | — | 2022-03-29 |