Issued Patents 2022
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11508776 | Image sensor semiconductor packages and related methods | Larry D. Kinsman, Yusheng LIN, Oswald Skeete, Weng-Jin Wu, Chi-Yao Kuo | 2022-11-22 |
| 11476292 | Multi-chip packaging structure for an image sensor | — | 2022-10-18 |
| 11444111 | Image sensor package having a light blocking member | I-Lin Chu | 2022-09-13 |