Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11417749 | Semiconductor arrangement with airgap and method of forming | Gulbagh Singh, Kun-Tsang Chuang, Tsung-Han Tsai | 2022-08-16 |
| 11348944 | Semiconductor wafer with devices having different top layer thicknesses | Gulbagh Singh, Kuan-Liang Liu, Kun-Tsang Chuang, Hsin-Chi Chen | 2022-05-31 |