Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11488912 | Method for forming recesses in a substrate by etching dummy fins | Chih-Teng Liao, Yi-Wei Chiu, Tzu-Chan Weng | 2022-11-01 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11488912 | Method for forming recesses in a substrate by etching dummy fins | Chih-Teng Liao, Yi-Wei Chiu, Tzu-Chan Weng | 2022-11-01 |