Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11380593 | Semiconductor fin cutting process and structures formed thereby | Jaming Chang, Kai Hung Cheng, Chia-Hui Lin, Jei-Ming Chen | 2022-07-05 |
| 11296198 | Semiconductor structure with barrier layer and method for forming the same | Chung-Ting Ko, Hong-Hsien Ke, Chia-Hui Lin, Tai-Chun Huang | 2022-04-05 |