Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11380593 | Semiconductor fin cutting process and structures formed thereby | Shih-Wen Huang, Kai Hung Cheng, Chia-Hui Lin, Jei-Ming Chen | 2022-07-05 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11380593 | Semiconductor fin cutting process and structures formed thereby | Shih-Wen Huang, Kai Hung Cheng, Chia-Hui Lin, Jei-Ming Chen | 2022-07-05 |