Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11437491 | Non-conformal capping layer and method forming same | Cheng-I Lin, Chun-Heng Chen, Chi On Chui | 2022-09-06 |
| 11296084 | Deposition method, semiconductor device and method of fabricating the same | Cheng-I Lin, Chun-Heng Chen, Chi On Chui | 2022-04-05 |