Issued Patents 2022
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11488855 | Dielectric gap-filling process for semiconductor device | Bang-Tai Tang | 2022-11-01 |
| 11437491 | Non-conformal capping layer and method forming same | Ming-Ho Lin, Chun-Heng Chen, Chi On Chui | 2022-09-06 |
| 11296084 | Deposition method, semiconductor device and method of fabricating the same | Chun-Heng Chen, Ming-Ho Lin, Chi On Chui | 2022-04-05 |