Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11417566 | Semiconductor device structure with interconnect structure and method for forming the same | Chun-Hao Kung, Chih-Chieh Chang, Hui-Chi Huang, Kei-Wei Chen | 2022-08-16 |
| 11373879 | Chemical mechanical polishing method | Tung-Kai Chen, Ching-Hsiang Tsai, Chih-Chieh Chang, Chun-Hao Kung, Fang-I Chih +4 more | 2022-06-28 |