Issued Patents 2022
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11482426 | Double patterning method | Chia-Ying Lee | 2022-10-25 |
| 11456210 | Integrated circuit and method for manufacturing the same | Kuan-Wei Huang, Yi-Nien Su, Yu-Yu Chen | 2022-09-27 |
| 11411176 | Gradient protection layer in MTJ manufacturing | Tai-Yen Peng, Yu-Shu Chen, Sin-Yi Yang, Chen-Jung Wang, Chien-Chung Huang +2 more | 2022-08-09 |
| 11404245 | DC bias in plasma process | Sheng-Liang Pan, Bing Chen, Chia-Yang Hung, Shu-Huei Suen, Syun-Ming Jang +1 more | 2022-08-02 |
| 11398405 | Method and apparatus for back end of line semiconductor device processing | Chung-Wen Wu, Chih-Yuan Ting | 2022-07-26 |
| 11322393 | Method of forming a semiconductor device | Yi-Nien Su, Shu-Huei Suen, Ru-Gun Liu | 2022-05-03 |
| 11271150 | Integrated circuit | Tai-Yen Peng, Chien-Chung Huang, Yu-Shu Chen, Sin-Yi Yang, Chen-Jung Wang +3 more | 2022-03-08 |
| 11217476 | Method of forming an interconnect structure of a semiconductor device | Tai-Yen Peng | 2022-01-04 |