Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11450586 | Heat dissipation structure, semiconductor packaging device, and manufacturing method of the semiconductor packaging device | Chi-Ming Yang, YEN-CHAO LIN | 2022-09-20 |
JC
Jia-Liang Chen
Global Unichip: 1 patents #11 of 38Top 30%
Overall (2022): #405,957 of 548,613Top 75%
1
Patents 2022