HT

Hsiang-Jen Tseng

TSMC: 3 patents #883 of 3,577Top 25%
Overall (2022): #79,407 of 548,613Top 15%
3
Patents 2022

Issued Patents 2022

Showing 1–3 of 3 patents

Patent #TitleCo-InventorsDate
11532586 Connecting techniques for stacked substrates Wei-Yu Chen, Ting-Wei Chiang, Li-Chun Tien 2022-12-20
11437321 Standard-cell layout structure with horn power and smart metal cut Ni-Wan Fan, Ting-Wei Chiang, Cheng-I Huang, Jung-Chan Yang, Lipen Yuan +1 more 2022-09-06
11217553 Connection structure for stacked substrates Wei-Yu Chen, Ting-Wei Chiang, Li-Chun Tien 2022-01-04