Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11450557 | Poisoned metal layer with sloped sidewall for making dual damascene interconnect | Min Han HSU, Jung-Chih Tsao | 2022-09-20 |
| 11276699 | Surface topography by forming spacer-like components | Chun-Chang Wu, Chihy-Yuan Cheng, Sz-Fan Chen, Shun-Shing Yang, Wei-Lin Chang +2 more | 2022-03-15 |