Issued Patents 2022
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11458586 | Planarization method, method for polishing wafer, and CMP system | Chung-Liang Cheng, Wei Zhang, Yen-Yu Chen | 2022-10-04 |
| 11434394 | Adhesive having increased bonding strength | Fung Ling Yap, Siew Ling Chong, Zhan Cheng | 2022-09-06 |
| 11265593 | Display device, hardware dongle capable of coupling to the display device, and method for controlling the display device | Chen-Cheng Huang | 2022-03-01 |