Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11434394 | Adhesive having increased bonding strength | Chang-Sheng Lee, Siew Ling Chong, Zhan Cheng | 2022-09-06 |
FY
Fung Ling Yap
Agency For Science, Technology And Research: 1 patents #21 of 213Top 10%
Overall (2022): #452,490 of 548,613Top 85%
1
Patents 2022