Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11335593 | Interconnect structure of semiconductor device including barrier layer located entirely in via | Yi-Wei Chiu, Hung Jui Chang | 2022-05-17 |
BS
Bo-Jhih Shen
Overall (2022): #513,636 of 548,613Top 95%
1
Patents 2022