Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11497125 | Bonded substrate, metal circuit board, and circuit board | Yuta TSUGAWA, Ryota Aono | 2022-11-08 |
| 11292975 | Powder fuel supply apparatus, gasfier unit, integrated gasification combined cycle, and control method of powder fuel supply apparatus | Yuichiro Urakata, Jun Kasai | 2022-04-05 |