Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11497125 | Bonded substrate, metal circuit board, and circuit board | Koji Nishimura, Ryota Aono | 2022-11-08 |
| 11430727 | Ceramic circuit substrate | Ryota Aono, Fumihiro Nakahara, Kouji Nishimura | 2022-08-30 |