Issued Patents 2022
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11515845 | Direct substrate to solder bump connection for thermal management in flip chip amplifiers | Michael Joseph McPartlin, Bharatjeet Singh Gill | 2022-11-29 |
| 11374610 | Radio front end module with reduced loss and increased linearity | Foad Arfaei Malekzadeh, Sanjeev Kumar Jain | 2022-06-28 |
| 11323158 | Beamforming communication systems with power amplifier output impedance tuning control | Dominique Michel Yves Brunel, William J. Domino | 2022-05-03 |
| 11283170 | Apparatus and methods for dynamic management of antenna arrays | — | 2022-03-22 |
| 11245190 | Planar end fire antenna for wideband low form factor applications | Foad Arfaei Malekzadeh, Abdulhadi Ebrahim Abdulhadi, Dinhphuoc Vu Hoang | 2022-02-08 |