Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11515845 | Direct substrate to solder bump connection for thermal management in flip chip amplifiers | Michael Joseph McPartlin, Stephen Joseph Kovacic | 2022-11-29 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11515845 | Direct substrate to solder bump connection for thermal management in flip chip amplifiers | Michael Joseph McPartlin, Stephen Joseph Kovacic | 2022-11-29 |