Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11476572 | Method for fabricating electronic package structure | Chih-Yuan Shih, Chih-Hsien Chiu, Tsung Li Lin, Chi-Pin Tsai, Chien-Cheng Lin +3 more | 2022-10-18 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11476572 | Method for fabricating electronic package structure | Chih-Yuan Shih, Chih-Hsien Chiu, Tsung Li Lin, Chi-Pin Tsai, Chien-Cheng Lin +3 more | 2022-10-18 |